| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device and an inspection method of an IC applicable for mass production inspection, wherein the inspection time per IC is shortened and a large quantity of IC's are inspected in a short time. SOLUTION: This inspection device of the IC comprises a host control device 1 and an inspection device body 10. The inside of the inspection device body 10 includes a device 2 for each pin for applying and measuring a signal individually, relative to each pin in the inspection IC, and is controlled from the host control device 1 by a control bus 6. Data in a condition setting/determination value memory 3 are distributed to a signal source of the device 2 for each pin and a determination circuit 4 via a route a and a route c; and a measured value from a measuring device of the device 2 for each pin is introduced to the determination circuit 4 via a route b, and is determined in the determination circuit 4, in reference to a specified value given from the route c. Each condition setting/determination value memory 3 outputs stored data by an order from a simultaneous memory selection bus 7. The result of the determination circuit 4 is connected to a base of a transistor 5 through a route d, and a collector is connected to a common simultaneous determination bus 8, to thereby constitute a wired NOR circuit. The circuit is controlled or referred to, via the simultaneous memory selection bus 7 and the simultaneous determination bus 8. COPYRIGHT: (C)2005,JPO&NCIPI
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