| 摘要 |
PROBLEM TO BE SOLVED: To provide a brazing material which can suppress an occurrence of a void in a jointed portion by setting its melting point between 260-425°C and improving its wettability with a solder. SOLUTION: The semiconductor device is assembled by die-bonding semiconductor elements using a brazing material composed of: 30-65 mass% Sb, 0.001-0.5 mass% P, and the balance being Sn and inevitable impurities; or 30-65 mass% Sb, 0.001-0.5 mass% P, 0.01-5 mass% in total of one or more kinds among Ag, Cu, Fe and Ni, and the balance being Sn and inevitable impurities. COPYRIGHT: (C)2005,JPO&NCIPI
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