| 摘要 |
PROBLEM TO BE SOLVED: To prevent scattering and cracking of a substrate in a coating process and to reduce the amount of a chemical solution to be used in regard to a chemical solution coating method and a chemical solution coating apparatus. SOLUTION: A chemical solution coating method includes: a first process of disposing a semiconductor substrate on a substrate supporting unit with a first face to be coated with a chemical solution facing upward; a second process of moving a chemical solution spraying member for spraying the chemical solution to an initial position which is positioned in the vicinity of the first face of the semiconductor substrate and where the chemical solution is to be applied; and a third process of moving the chemical solution spraying member from the initial position in accordance with a predetermined travel pattern and, simultaneously, spraying the chemical solution from the chemical solution spraying member toward the first face of the semiconductor substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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