DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A wafer manufacturing method capable of improving yielding and facilitating bonding in a device having micro mechanical elements formed by MEMS technology, wherein opening parts are shared by pads in a plurality of areas when a plurality of first wafers having the micro mechanical elements and pads formed thereon are stuck on a second wafer having the opening parts formed therein. Since the sufficient opening parts are provided in the upper parts of the pads when the wafer is cut off into chips, a wire bonder used so far can be used. Also, these two wafers are individually cut off in a step where the two stuck wafers are diced into the chips. Thus, since the chipping of the wafer can be reduced, the yielding in the dicing step can be improved.