| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad particularly effective to improve the proper value maintenance of a polishing rate and in uniformity in a surface after polishing a material to be polished and extremely effective in manufacturing such as the chemical mechanical polishing, etc. of a semiconductor wafer, etc., by solving simultaneously subjects such as the unevenness or decreases of the polishing rate, the large unevenness of an amount of polishing in the surface of a water, the excessive consumption of polishing slurry, and further unable to hold suitable slurry between the material to be polished and the polishing pad, and to provide a method of polishing. <P>SOLUTION: The polishing pad 1 includes a plurality of parallel groove groups made of substantially straight line grooves parallel to each other in the polishing surface. At least the groove 2 has different groove depths in the one and same groove. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
