| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad for CMP by which a uniform surface can be obtained over the entire surface of a polished body by holding a proper amount of polishing slurry at a polishing position of a polished body, thus improving a polishing rate, and which does not cause suction to the polished body. <P>SOLUTION: The polishing pad 1 for CMP has, on the top surface of a polishing layer having mutually parallel top and reverse surfaces, a surface shape having both wall-shaped projection streaks 2 and projection parts 3 having a height perpendicular to the polishing layer surface, a width sandwiched between two mutually parallel main surfaces, and a length parallel to the polishing layer surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
