| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a printed-wiring board for flip-chip mounting that can be mounted without manufacturing any bumps on the rear of a semiconductor chip. <P>SOLUTION: In a manufacturing method, a resin composition layer (c) that is slightly soluble to a chemical liquid is arranged after curing on the semiconductor chip mounting surface of a circuit board, a resin composition layer (o) that is soluble to the chemical liquid is oppositely arranged on one side of copper foil on the resin composition layer (c), curing is made, a hole is formed at a semiconductor chip mounting section, the inside of the hole is filled with copper plating (n), surface-layer copper foil and copper-plated portion are etched flatly by the chemical liquid in a thickness direction, the resin composition layer (o) soluble to a chemical liquid (m) is dissolved for removal, and a tip (n) at a copper plating filling section is allowed to project from the surface of the resin composition layer that is slightly soluble to the chemical liquid. The printed-wiring board for flip-chip mounting is manufactured by the manufacturing method. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
