| 摘要 |
PROBLEM TO BE SOLVED: To reduce a mounting area when an electronic device for example is mounted on an external connection substrate, to reduce the deterioration of characteristics owing to the occurrence of a paracitic component, and further to uniformize an area of an external connection terminal between mounting substrates. SOLUTION: The mounting substrate 14 has a first principal surface 14a which constitutes a mounting surface on which an electronic device 20 is mounted, and on which an electrode pattern is formed including a plurality of electrode pads P electrically connected to the electronic device 20 via a bump 21, and has a second principal surface 14b on which a plurality of input/output terminals S positioned on the opposite side to the first principal surface 14a and electrically connected to the electrode pad P are formed. In the mounting substrate, all input/output terminals S are formed at a position separated away from a peripheral end of the mounting substrate 14. COPYRIGHT: (C)2005,JPO&NCIPI |
