发明名称 INSULATING RESIN SHEET AND WIRING SUBSTRATE MANUFACTURED BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a halogen-free wiring substrate having a low percentage of water absorption and a low dielectric dissipation factor, suitable for high-frequency use and having good flame retardance. SOLUTION: The insulating resin sheet is obtained by impregnating a fiber substrate 1 with a thermosetting resin composition 2 prepared by adding and mixing 100 pts. mass of a modified polyphenylene ether resin with 1-10 pts. mass of a cross-linking agent, 10-40 pts. mass of an elastomer for imparting flexibility, 10-50 pts. mass of a flame retardant composed of a phosphazene compound and 30-100 pts. mass of an inorganic insulating filler composed of a metal hydroxide. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005179397(A) 申请公布日期 2005.07.07
申请号 JP20030418488 申请日期 2003.12.16
申请人 KYOCERA CORP 发明人 KIRIKIHIRA ISAMU
分类号 C08J5/04;C08K3/22;C08L71/12;H05K3/46;(IPC1-7):C08J5/04 主分类号 C08J5/04
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