发明名称 |
Die molding for flip chip molded matrix array package using UV curable tape |
摘要 |
An embodiment of the present invention is a technique to package flip chip molded matrix array package. An ultraviolet (UV) curable tape is laminated on die backside of a strip of array of flip chips. The UV curable tape has an adhesive strength. The strip of flip chip arrays is molded with a mold film. The molded strip of flip chip array is irradiated using UV radiation. In another embodiment, a double functional tape is mounted to backside of a wafer. The double functional tape includes a binding tape and a ultraviolet (UV) curable tape having an adhesive strength. The wafer is singulated into die. The die is attached to a substrate strip to form a strip of array of flip chips. The strip is molded with a mold film. The molded strip is irradiated using UV radiation. |
申请公布号 |
US2005145328(A1) |
申请公布日期 |
2005.07.07 |
申请号 |
US20030745728 |
申请日期 |
2003.12.24 |
申请人 |
LIM SZU S.;LIM SHEOU H.;CHEONG YEW W. |
发明人 |
LIM SZU S.;LIM SHEOU H.;CHEONG YEW W. |
分类号 |
B29C45/14;H01L21/56;H01L21/68;(IPC1-7):B32B31/00;B32B1/00;B65H29/00 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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