| 摘要 |
PROBLEM TO BE SOLVED: To provide a low cost and highly reliable substrate for a semiconductor module having a slow deterioration in thermal stress with a conventional shape. SOLUTION: Thw substrate 10 for the semiconductor module comprises a wiring metal plate 12 for mounting a semiconductor element 13 bonded on one main surface of the ceramic substrate 11, a solid metal plate 15 for radiating heat from the semiconductor element 13 bonded on the other main surface of the ceramic substrate 11, and a heatsink plate 18 solder bonded by a solder 19 having a surface 17 of a bonding side larger than the bonding surface 16 of the solid metal plate 15. The bonding area 20 of the bonding side surface 17 of the heatsink plate 18 with the solid metal plate 15 bonded is equal to or less than the bonding surface 16 of the solid metal plate 15 and has a similar-figure dimension. The surface other than the bonding area 20 of the heatsink plate 18 has an oxidized metal layer 21. COPYRIGHT: (C)2005,JPO&NCIPI |
