发明名称 LEAD FRAME, SURFACE-MOUNTING SEMICONDUCTOR DEVICE USING THE SAME AND ELECTRONIC APPARATUS MOUNTED THEREWITH
摘要 PROBLEM TO BE SOLVED: To arrange a tie bar cut trace portion included in a lead terminal at a position where it is not overlapped between the adjacent lead terminals, whereby a lead space of a tie bar is expanded to suppress the occurrence of a solder bridge in the tie bar cut trace portion of the lead terminal. SOLUTION: A plurality of tie bars 9 comprise a plurality of lead terminals 3 projected from a seal resin part 2, and are hung between the respective lead terminals 3. The plurality of tie bars 9 are obliquely provided with respect to the width direction of the lead terminal 3, and also an inclination angle of the tie bar 9 is set so that a lead terminal connection position of one end 19 of the tie bar 9 is overlapped on a lead terminal connection position of the other end 29 thereof when viewed from the width direction of the lead terminal 3. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005183695(A) 申请公布日期 2005.07.07
申请号 JP20030422979 申请日期 2003.12.19
申请人 SHARP CORP 发明人 NAKAZAWA YASUHISA;NAKAMURA YUICHI
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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