| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer print-circuit board in which a blind via having high reliability is formed, and a manufacturing method for the multilayer print-circuit board capable of easily forming the blind via having the high reliability. SOLUTION: The multilayer print-circuit board is constituted so as to arrange cores 11a and 11b on the surface layer side. The multilayer print-circuit board is constituted so as to form the blind vias 13a and 13b and receiving lands 14a and 14b for the blind vias 13a and 13b to the cores 11a and 11b, respectively. COPYRIGHT: (C)2005,JPO&NCIPI |
