| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component which can correspond to miniaturization of a lamination type electronic component, high performance and high quality. SOLUTION: A ceramic part with a pattern space for inner electrode formation is formed in a conductive substrate surface in a first prescribed thickness, an inner electrode layer with a second prescribed thickness which is thinner than the first prescribed thickness is formed by an electrodeposition method in the pattern space wherein the conductive substrate surface is exposed, and a dielectric layer is further formed in an upper surface of the inner electrode layer by the electrodeposition method. When the first prescribed thickness of the ceramic part almost coincides with the sum of the thickness of lamination of the second prescribed thickness (an inner electrode layer) and a third prescribed thickness (the dielectric layer), formation of the dielectric layer is finished and an inner electrode inclusion type ceramic green sheet is obtained. COPYRIGHT: (C)2005,JPO&NCIPI
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