| 摘要 |
PROBLEM TO BE SOLVED: To prevent the bumping of a second electrode layer when the sheath-less surface-mounting metallized film capacitor undergoes lead-free reflow soldering, to eliminate bad external appearance; and to improve moisture resistance. SOLUTION: A metallized film capacitor and its manufacturing method are configured in such a way that a capacitor element is formed by winding in layers a later winding plastic film on an element on which a pair of metallized films is wound. After the first electrode layer of an electrode lead is formed on opposite end surfaces of the capacitor element, a second electrode layer is formed and an external electrode is mounted. Herein, the second electrode layer is formed after the first electrode layer is formed, impregnated in resin, and hardened. The foregoing resin is epoxy resin or silicone resin of 1 to 1000 mPa s viscosity, and the first electrode layer is constituted by any of an alloy consisted of 60 to 70 % copper and remaining zinc, an alloy consisted of 40 to 56 % aluminum,≥4% silicon, and≥40% zinc, an alloy consisted of≥90 % zinc and remaining aluminum, and single zinc. The second electrode layer is consisted of≥80% tin and remaining zinc and copper. COPYRIGHT: (C)2005,JPO&NCIPI
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