| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding structure and a bonding method of terminals capable of constituting high density and narrow pitch, materializing reduction in thickness, in size, and in manufacturing cost, and eliminating limitation on the degree of freedom of design and oxidation and peeling of the bonding area. SOLUTION: In the bonding structure of terminals, the Au plating film 15 of the connecting terminal of FPC is bonded to the Au plating film 25 of the connecting terminal of RPC. Moreover, one or more gaps 31 are formed at the bonding interface of a couple of bonded Au plating films 15, 25. COPYRIGHT: (C)2005,JPO&NCIPI
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