发明名称 ELECTROLESS PLATING TOOL, AND ELECTROLESS PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electroless plating tool suitable for depositing a thick plating film on a surface of a work. SOLUTION: When performing electroless nickel plating on a steel-made work W, an electroless plating tool where a plurality of hook-shaped work holding parts 4 consisting of stainless steel wire are formed on a stainless steel-made tool body is used. Since the work holding parts 4 are covered with a heat-shrinkable tube 9, the electroless plating tool can be insulated from the work W. Thus, a thick plating film can be stably deposited, and the plating film is not deposited on the electroless plating tool. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005179706(A) 申请公布日期 2005.07.07
申请号 JP20030419108 申请日期 2003.12.17
申请人 HAIRAITO:KK 发明人 OKABE KENICHI
分类号 C23C18/31;(IPC1-7):C23C18/31 主分类号 C23C18/31
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