发明名称 ELECTRIC CIRCUIT MODULE
摘要 PROBLEM TO BE SOLVED: To provide an electric circuit module that can stabilize thermal resistance between a heat dissipation member and an electric device and is superior in assembling property and inexpensive. SOLUTION: A recessed part 7 is formed at a fixing jig 1 to house a part of an electric device, and the fixing jig 1 is brought into contact at least with the side of the packaging material of the electric device excluding a heat dissipation surface, thereby improving the positioning accuracy of the electric device in the fixing jig 1. The electric device is pressurized on the heat dissipation member 2 by means of the elastic force of the entire fixing jig 1 including the recessed part 7, and a plurality of lead wires 5 of the electric device are allowed to penetrate openings 6 formed adjacent to the recessed part 7 of the fixing jig 1, and then a falling prevention jig for preventing the falling of the electric device when the fixing jig 1 is assembled to the heat dissipation member 2 is assembled to the fixing jig 1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005183644(A) 申请公布日期 2005.07.07
申请号 JP20030421787 申请日期 2003.12.19
申请人 HITACHI LTD;HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO LTD 发明人 NAKATSU KINYA;TAKADA NAOKI;HIROTA MASAYUKI;IBORI SATOSHI;KAMEZAWA TOMOYA
分类号 H05K7/20;H01L23/367;H01L23/40;H01L25/07;H01L25/11;H01L25/18;(IPC1-7):H01L25/07 主分类号 H05K7/20
代理机构 代理人
主权项
地址