发明名称 Guide flow heat sink
摘要 A heat sink includes a heatsink board, and a cooling fan. The heatsink board includes a top plate, a bottom plate, and a plurality of separation plates forming a plurality of guide layers between the top plate, the separation plates and the bottom plate. Each of the guide layers is formed with a plurality of hollow flow channels. Thus, each of the flow channels provides an air guide effect, and the cooling fan provides a force convection effect, so that the heat of the heat source absorbed by the top plate and the bottom plate is carried away and is drained outward from the heatsink board, thereby enhancing the heat dissipation effect of the heat sink.
申请公布号 US2005145365(A1) 申请公布日期 2005.07.07
申请号 US20030746634 申请日期 2003.12.24
申请人 CHANG HUNG-SHEN 发明人 CHANG HUNG-SHEN
分类号 F28F13/00;H01L23/467;(IPC1-7):F28F7/00 主分类号 F28F13/00
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