发明名称 SUBSTRATE JOINT BODY, MANUFACTURING METHOD OF SUBSTRATE JOINT BODY, ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate joint body capable of securing space between an electro-optical substrate and a driving circuit substrate, and of securing conductive connection between a luminescent function element and a drive element by restraining separation, breakage and the like of a conductive member even when warpage or the like of the substrate occurs. <P>SOLUTION: This substrate joint body 2 is composed by sticking a first substrate 3 with a first function element 13 formed to a second substrate 4 with a second function element 21 formed. A joint part 50 for conductively connecting the first function element 13 to the second function element 21 is formed with a resin core part 51 and a conduction part 52 partially or entirely covering the resin core part 51. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005183031(A) 申请公布日期 2005.07.07
申请号 JP20030418013 申请日期 2003.12.16
申请人 SEIKO EPSON CORP 发明人 SUZUKI KAZUHIKO
分类号 H01L51/50;G09F9/30;H05B33/10;H05B33/14 主分类号 H01L51/50
代理机构 代理人
主权项
地址