摘要 |
<P>PROBLEM TO BE SOLVED: To provide a material whose coefficient of thermal expansion is made as constant as possible so as to be particularly advantageously used in micro-lithography, in particular EUV(extreme-ultraviolet)-lithography. <P>SOLUTION: The fluorine doped at least ternary silicate glass contains in particular TiO<SB>2</SB>. The glass is constituted so as to be advantageously used as a material having a low thermal expansion, wherein the slope of the coefficient of thermal expansion is between ±2×10<SP>9</SP>/K<SP>2</SP>in the temperature range of -50 to 100°C. This material is particularly suited for micro-lithography, in particular EUV-lithography. <P>COPYRIGHT: (C)2005,JPO&NCIPI |