| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device such that a mount member for a semiconductor chip and a base member are formed in one member in extremely inexpensive integral structure and electrically connected with a low resistance value of only resistance that metal has. SOLUTION: This semiconductor device is equipped with a wiring board 12 where wires are formed, the semiconductor chip 13 which is electrically connected to the wires, and the metallic base member 15 where the wiring board 12 and semiconductor chip 13 are mounted. A mount area 14 for the semiconductor chip 13 is formed integrally with the base member 15 to project to the mount surface side of the wiring board 12. The mount area 14 for the semiconductor chip is formed by pressing the base member 12 and a groove 20 indicating the position where the semiconductor chip is mounted is provided on the mount surface 14a of the mount area 14 for the semiconductor chip. Further, the mount area 14 for the semiconductor chip has corners rounded. COPYRIGHT: (C)2005,JPO&NCIPI |
