| 摘要 |
PROBLEM TO BE SOLVED: To provide an electro-optical composite device for which a mounting structure and packaging process of an existing wiring board can be utilized, a large-scale structure can be eliminated, wiring can be made to have high density, and a structure permitting to shorten a wiring length between a semiconductor chip and an optical element can be realized, and to provide a socket used therefor, and a mounting structure of the electro-optical composite device. SOLUTION: The electro-optical composite device 6 is provided with the socket 1 and an optical waveguide 9 arranged in this socket 1, wherein at least either a light emitting element for making the light incident to the optical waveguide 9 or a light receiving element for receiving the exit light from the optical waveguide 9 is arranged opposite to the optical waveguide 9. The socket for the electro-optical composite device has an installation part 2 for installing the optical waveguide 9, wherein at least either the light emitting element or the light receiving element is arranged corresponding to the optical waveguide 9. In the mounting structure of the electro-optical composite device, the electro-optical composite device of this invention is fixed in a state in which it is electrically connected to the printed wiring board 14. COPYRIGHT: (C)2005,JPO&NCIPI |
