| 摘要 |
PROBLEM TO BE SOLVED: To cause a surface inspection device itself conduct centering of a wafer, thereby carrying out the centering and chucking of the wafer, surely, rapidly and with high accuracy. SOLUTION: This surface inspection device is equipped with a wafer table 7 rotated by a motor 4, a pair of clamp arms 14 provided rotatably relative to the wafer table, an energizing means 25 for energizing the clamp arms to rotate them in the center direction, a circular arc-shaped rest seat 9 provided on the wafer table for resting thereon a peripheral part of a wafer 12, and circular arc-shaped clamping nails 18 provided on the clamp arms, to make contact with the periphery of the wafer. The clamping arms are rotatable, centered about a position different from the rotation center of the motor. The clamping nails depart from the rest seat due to the anti-center side rotation of the clamping arms. In a clamping state of the clamping arms, the periphery of the wafer is clamped between the rest seat and the clamping nail. COPYRIGHT: (C)2005,JPO&NCIPI |
