| 摘要 |
PROBLEM TO BE SOLVED: To efficiently and inexpensively carry out an exposure process for a printed circuit board. SOLUTION: A substrate 1 carried from a carrying-in section A to an aligning section B is held between a single upper side holding member 8 made of a light transmitting material to which original plate films F1, F2 are laminated, and one lower side holding member 9A of two lower side holding members 9A, 9B so as to prepare a laminate 7. The laminate 7 is carried to an exposing section C, and both surfaces of the laminate 7 is exposed by an exposure lamp 50 while the body is inverted by an inverting machine 60. The exposed substrate 1 is fixed to the lower side holding member 9A by using a substrate holding mechanism, while only the upper side holding member 8 is moved to the aligning section B, and the substrate 1 on the lower side holding member 9A is moved from the exposing section C to a discharge section D by using a discharge carrier 5. The lower holding members 9A, 9B are alternately reciprocally moved in the aligning section B and the exposing section C and are used as exchanged. COPYRIGHT: (C)2005,JPO&NCIPI
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