发明名称 |
System and method for self-leveling heat sink for multiple height devices |
摘要 |
A self-leveling heat sink includes a spring-arm device having at least one aperture and at least one spring-arm is coupled to a substrate. The substrate has at least one package mounted thereon, so that when the spring-arm device is mounted to the substrate the at least one package passes through the at least one aperture. A heat sink operable to remove heat from the at least one package has at least one heat sink post operable to receive a heat sink clip located at the distal end of each of the at least one spring-arms. Each of the at least one spring-arms extending from an inside edge of the at least one aperture and operable to couple the heat sink to the at least one package.
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申请公布号 |
US2005146023(A1) |
申请公布日期 |
2005.07.07 |
申请号 |
US20030749609 |
申请日期 |
2003.12.31 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
EDWARDS DARVIN R. |
分类号 |
H01L21/48;H01L23/10;H01L23/40;H05K7/20;(IPC1-7):H01L23/10 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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