METHOD AND DEVICE FOR DRYING CIRCUIT SUBSTRATES

摘要

The invention relates to a method and to a device for drying circuit substrates (13), in particular semi-conductor substrates. According to the invention, a circuit surface (30) is rinsed by means of a rinsing liquid (10) during a rinsing phase and is dried in a subsequent drying phase. In the rinsing phase, the circuit substrate is displaced in a direction of the flat extension thereof, transversally and in relation to a liquid level (28) of the rinsing liquid mirror, in such a manner that a liquid meniscus is formed in a transition area which varies according to the relative movement thereof, between the circuit surface and the liquid level, and the transition area moistened by the liquid meniscus is impinged upon by thermal radiation (36) in the drying phase.