| 摘要 |
According to the invention, the distribution of material amounts deposited on the substrate may be optimised for magnetron sputter coating in which a magnetron magnetic field pattern (9) is cyclically (My) moved along the sputtering surface (7) and a substrate (11) is passed along the sputter surface (7), whereby the sputter rate is modulated by means of a modulation device (3), phase-locked with the cyclical movement (My) of the field pattern (9).
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