发明名称 Planar heat pipe structure
摘要 An improved structure of a planar heat pipe, having a top lid and a bottom lid. The bottom lid can be engaged with the top lid. A wick structure and a working fluid are installed in the heat pipe. The top lid has a top panel, which has a central flat area and a plurality of independent heat dissipating fins spirally arranged around the flat area. Each of the heat dissipating fins has a cone shape, and the height of the heat dissipating fins gradually increases from the center to the periphery of the top lid. A spiral heat circulating path is thus formed on the top lid. Thereby, when the cooling fan generates cooling air flow downwardly, an air impingement is formed upon the flat region of the top lid. The heat accumulated in the central flat region is then dissipated by the heat dissipating fins with an enhanced efficiency.
申请公布号 US6913070(B2) 申请公布日期 2005.07.05
申请号 US20030653104 申请日期 2003.09.03
申请人 WANG CHIN WEN;WANG PEI CHOA;WANG CHING CHUNG 发明人 WANG CHIN WEN;WANG PEI CHOA;WANG CHING CHUNG
分类号 H01L23/427;H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/427
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