发明名称 Differential planarization
摘要 Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dimensions and uniformity of various layers may be accurately controlled using the disclosed techniques.
申请公布号 US6914002(B2) 申请公布日期 2005.07.05
申请号 US20020334308 申请日期 2002.12.28
申请人 INTEL CORPORATION 发明人 BOARDMAN JAMES A.;KIM SARAH E.;FISCHER PAUL B.;KOBRINSKY MAURO J.
分类号 H01L21/768;(IPC1-7):H01L21/302 主分类号 H01L21/768
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