| 摘要 |
To provide a wafer heating apparatus that can measure a surface temperature of a wafer accurately and responsively. A front surface of a ceramic plate 2 serves as a mounting surface on which a wafer is placed, and a rear surface or an inner portion of the ceramic plate 2 is formed with a resistance heating element 5. A recess 9 is formed in the rear surface of the ceramic plate 2. A temperature measuring member formed of a temperature sensor 8 a and leads 8 is inserted in the recess 9 so as to be held by filling 17. In the wafer heating apparatus, a length along the leads from the front of the protective tube to a point where the leads are exposed from the filling is set to 5 to 30 times an outer diameter of the protective tube.
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