发明名称 Method for fabricating capacitor in semiconductor device
摘要 A method for fabricating a capacitor for a semiconductor device is disclosed, which comprises the steps of: forming a storage node electrode on a semiconductor wafer, forming a dielectric layer made of a cyclic silicon nitride layer on the surface of the storage node electrode, and forming an upper electrode on the dielectric layer; lowering the thickness T<SUB>eff </SUB>of the dielectric layer and improving leakage current characteristics through use of a cyclic Si<SUB>3</SUB>N<SUB>4 </SUB>or a cyclic SiO<SUB>x</SUB>N<SUB>y </SUB>(wherein x falls between 0.1 and 0.9 and y falls between 0.1 and 2), having a large oxidation resistance and high dielectric ratio, as a dielectric.
申请公布号 US6913963(B2) 申请公布日期 2005.07.05
申请号 US20020331422 申请日期 2002.12.30
申请人 HYNIX SEMICONDUCTOR INC. 发明人 LEE TAE HYEOK;PARK CHEOL HWAN;PARK DONG SU;WOO SANG HO
分类号 C23C16/42;H01L21/02;H01L21/28;H01L21/31;H01L21/314;H01L21/318;H01L21/82;H01L21/8234;H01L21/8242;H01L21/8244;H01L27/04;H01L27/108;(IPC1-7):H01L21/824 主分类号 C23C16/42
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