发明名称 |
Chemical mechanical polishing endpoint detection system and method |
摘要 |
The system includes a polishing pad, a pad height sensor; a window; and a window raising mechanism. The polishing pad has an aperture with the window vertically moveable therein. The pad height sensor is positioned above the polishing pad and measures the vertical position of the pad before polishing. The window raising mechanism adjusts the vertical position of the window based on information from the pad height sensor. An endpoint measurement sensor can be disposed beneath the window for in-situ measurement of the polishing process.
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申请公布号 |
US6913514(B2) |
申请公布日期 |
2005.07.05 |
申请号 |
US20030602034 |
申请日期 |
2003.06.23 |
申请人 |
EBARA TECHNOLOGIES, INC. |
发明人 |
KIMURA NORIO;WANG HUEY-MING;KUMEKAWA MASAYUKI |
分类号 |
B24B37/04;B24B49/12;B24D7/12;(IPC1-7):B24B49/12 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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