| 摘要 |
<p>A transfer material comprising a substrate sheet (2, 52), strip-pattern mold release layers (3, 53) laid on the substrate sheet, an ionizing radiation curing layer (4, 54) entirely laid on the mold release layers, pattern layers (5, 55) laid entirely or partially on the ionizing radiation curing layer, and adhesive layers (6, 56) laid partially on the pattern layers at portions only that overlap the mold release layers.</p> |
