发明名称 Lamination system
摘要 A lamination system comprises a thermocompression bonding means for bonding laminate films on top and/or back surfaces of cards, applying heat and pressure using a pair of heat rollers. The lamination system is provided with contact type temperature detection devices for detecting surface temperatures of the heat rollers and a heat roller attaching/detaching device for attaching or detaching the heat rollers. The heat roller attaching/detaching device places the temperature detection devices in contact with surfaces of the heat rollers when the heat rollers are being installed in the lamination system, and places the temperature detection devices apart from the heat rollers when the heat rollers are to be attached to, or detached from, the lamination system.
申请公布号 US6913055(B2) 申请公布日期 2005.07.05
申请号 US20040910314 申请日期 2004.08.04
申请人 JAPAN SERVO CO., LTD. 发明人 SUGAYA KENJI;SHOJI KENSUKE
分类号 B42D15/10;B29C65/20;B29C65/40;B29L9/00;(IPC1-7):B32B31/00 主分类号 B42D15/10
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