发明名称 Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring
摘要 A metal film forming method, includes the steps of (a) (s 13 , s 15 ) supplying a plural kinds of ingredient gases to a base barrier film ( 3 ) in sequence, wherein at least one of the gases includes a metal, and (b) (s 14 , s 16 ) vacuum-exhausting the ingredient gases of the step (a) or substituting the ingredient gases of the step (a) by an other kind of gas after the ingredient gases of the step (a) are supplied respectively, thereby an extremely thin film ( 5 ) of the metal is formed on the base barrier film ( 3 ).
申请公布号 US6913996(B2) 申请公布日期 2005.07.05
申请号 US20020181273 申请日期 2002.07.16
申请人 TOKYO ELECTRON LIMITED 发明人 YAMASAKI HIDEAKI;TACHIBANA MITSUHIRO;OKUBO KAZUYA;SUZUKI KENJI;KAWANO YUMIKO
分类号 C23C16/30;H01L21/28;H01L21/285;H01L21/3205;H01L21/768;H01L23/52;(IPC1-7):H01L21/476;H01L21/44 主分类号 C23C16/30
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