发明名称 |
Electronic component module |
摘要 |
An electronic component module includes a mounting substrate including a shield layer and on which a first cavity and a second cavity are formed. A first electronic component positioned in the first cavity is used in a first frequency band. A second electronic component positioned in the second cavity is used in a second frequency band. Lid members seal the first cavity and the second cavity. Patch antennas transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface. And, connection terminals formed on the mounting substrate are electrically connected to the electronic components through transmission lines.
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申请公布号 |
US6914787(B2) |
申请公布日期 |
2005.07.05 |
申请号 |
US20040847308 |
申请日期 |
2004.05.18 |
申请人 |
TDK CORPORATION |
发明人 |
AJIOKA ERIKO;ASAMI SHIGERU;SHIMODA HIDEAKI;IKEDA HIROSHI;YAMASHITA YOSHINARI;KURATA HITOYOSHI |
分类号 |
H05K9/00;H01Q1/52;H01Q9/04;H01Q21/06;H05K1/00;H05K1/02;H05K1/16;H05K1/18;(IPC1-7):H05K9/00 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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