| 发明名称 |
Semiconductor device provided using wiring data of common design core |
| 摘要 |
A semiconductor device includes a plurality of circuits, provided on a semiconductor substrate, each having a plurality of wiring layers. The plurality of circuits are designed using a common design core to which a plurality of wiring data are allocated. |
| 申请公布号 |
US6915498(B2) |
申请公布日期 |
2005.07.05 |
| 申请号 |
US20020190665 |
申请日期 |
2002.07.09 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HASHIBA YOSHIAKI;SEI TOSHIKAZU;UCHINO YUKINORI;FUJII SHINJI |
| 分类号 |
H01L21/3205;G06F17/50;H01L21/82;H01L21/822;H01L23/52;H01L23/522;H01L23/528;H01L27/04;H01L27/10;(IPC1-7):G06F17/50 |
主分类号 |
H01L21/3205 |
| 代理机构 |
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