| 摘要 |
A thermal print head has an insulative substrate (2), a glaze layer (21) formed on the substrate (2), a wiring pattern (22) formed on the glaze layer (21), and an electrode (6) connected to the wiring pattern (22). The electrode (6) includes a pad (61) overlapping the wiring pattern (22) and an upper layer (62) formed on the pad (61). The upper layer (62) has better solder wettability than the pad (61) and has a smaller area than the pad (61).
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