| 摘要 |
A method of providing thermal vias in a printed circuit board that includes one or more layers of board material is disclosed. The vias provide for conducting heat from components mounted on the board. One or more holes ( 4 ) are provided in a printed circuit board that may include several metal layers. A metal ball ( 6 ) is inserted into each hole and subjected to pressure such as to deform said ball, and tightly fixating the resultant slug against the wall ( 5 ) of said hole. The deformed ball or slug fixed in the hole, which may have a metallised inner surface, functions to conduct heat and/or electricity between a metallised topside ( 2 ) and bottom side ( 3 ) of the printed circuit board and also between intermediate metallised layers in the case of a multi-layer board.
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