| 摘要 |
<p>PURPOSE: A flip chip packaging method using a dam is provided to prevent pollution of circuits on a wafer by forming the dam on a matrix board, bonding a flip chip, hardening the dam, and dividing the flip chip into individual chips. CONSTITUTION: A stud bump is formed on a wafer(S2). A tape is adhered on one side of the wafer(S3). The wafer is cut in chip unit(S4). A dam is formed on a matrix board(S10). A flip chip is adhered on the matrix board including the dam by using applying the heat and ultrasonic waves(S5). The dam is hardened by heating the matrix board including a flip chip under the predetermined condition(S6). The flip chip is divided into individual chips by cutting the matrix board(S8).</p> |
