| 摘要 |
914,808. Semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. March 13, 1959 [March 17, 1958], No. 8780/59. Class 37. A semi-conductor device includes a semiconductor body in a sealed cylindrical casing mounted in and coaxial with a tubular cooling body longer than the casing. In the Fig. 1 arrangement a transistor is mounted in a housing located between waisted portion 13 and turned in flange 12 of a perforated copper or aluminium tube 11. The transistor is soldered through the intermediary of a molybdenum plate 7 to, a metal base 8, which is pressed into metal cylinder 1, preferably with the interposition of a soft indium, lead or tin layer. The base and emitter connections 6, 5, respectively, are led out through glass bead 9 and a tube 3 sealed into the glass top 2 of the housing. In the Fig. 3 arrangement, a diode housing comprises two parts welded together at flanges 31, the flanges being located between waisted portion 35 and the flange. A clip 33 provided with tags 36 bent over to fix it to chassis 32 has resilient locating tags 34 engaging the waisted portion 35. In the multiple arrangement shown in Fig. 4 diode housing 40 is mounted between two waisted portions of cooling cylinder 41. The cooling cylinders of several such devices are connected together as shown through ceramic insulators 48, adjacent diodes being connected electrically by members 45, the ends of which are formed as resilient clips. A number of diodes of the type shown in Fig. 4 may alternatively be mounted between a pair of insulating plates in an oil-filled trough, series connections being made by U-shaped connectors. |
