| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that a difference in temperature between a probe needle for inspecting the electrical property of a semiconductor device formed on a semiconductor wafer and an air for removing grinding chips of an electrode pad adhered thereto causes dewing and a contact resistance between the probe needle and the electrode pad becomes large, which affects a measured value of electrical testing. SOLUTION: The prober device is provided with an XYZ stage 6 on which a semiconductor wafer 7 is placed, a probe card 3 which is connected to a tester 8 and is provided with a probe needle 4 that is brought into contact with an electrode pad 7a of a semiconductor device formed on the semiconductor wafer 7 on the XYZ stage 6, and an air jetting nozzle means such as a jetting nozzle 9 or the like that jets an air to the probe needle 4 to remove grinding chips of the electrode pad 7a adhered to the probe needle 4. It is also provided with a temperature adjusting means such as a heat exchanging type air heater 21 or the like to adjust the temperature of an air to be jetted from the jetting nozzle 9. Thus, the temperature of the air is adjusted to eliminate a difference in temperature with the probe needle 4, thereby preventing dewing. COPYRIGHT: (C)2005,JPO&NCIPI
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