| 摘要 |
The present invention provides a multichip package wherein a plurality of semiconductor chip packages ( 100 ) in each of which first electrode pads ( 16 a) provided in a main surface of a semiconductor chip, and first bonding pads ( 20 a) and first central bonding pads ( 18 a) formed in an upper area of the main surface are respectively electrically connected by first redistribution wiring layers ( 24 ) in a one-to-one correspondence relationship, and second electrode pads ( 17 b), and second bonding pads ( 22 b) and second central bonding pads ( 18 b) formed in an upper area of the main surface are respectively electrically connected by second redistribution wiring layers ( 26 ) in a one-to-one correspondence relationship, are stacked on one another.
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