发明名称 |
Package for housing optical semiconductor element and optical semiconductor apparatus |
摘要 |
Provided is a package for housing an optical semiconductor element including: a metal-made base body; a metal-made lid body; a light-transmitting member; and an input/output terminal joined to the upper principal surface of the base body so as to cover a through bore. The input/output terminal includes: a dielectric-made first plate portion; a line conductor extending from one base body-side edge to another edge opposite thereto; a dielectric-made second plate portion stacked with its one base body-side end face made flush with the first plate portion; a metal plate made higher than the first plate portion and stacked with its one base body-side end face made flush with the first plate portion; and a lead terminal attached to the lower surface of the input/output terminal lying inside the through bore and electrically connected to the line conductor.
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申请公布号 |
US2005141826(A1) |
申请公布日期 |
2005.06.30 |
申请号 |
US20040977557 |
申请日期 |
2004.10.29 |
申请人 |
KYOCERA CORPORATION |
发明人 |
MATSUZAKI AKIKO;SHIBAYAMA HIROSHI |
分类号 |
H01L23/02;G02B6/42;H01L31/0203;H01S5/022;(IPC1-7):G02B6/36 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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