发明名称 |
Plating method and plating apparatus |
摘要 |
A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected by variations in the shape of trenches and via holes. The plating method includes a first plating process and a second plating process. The second plating process is performed by filling a plating solution between an anode and a substrate, with a porous member placed in the plating solution, repeatedly bringing the porous member and the substrate into and out of contact with each other, passing a current between the anode and the substrate while the porous member is being held in contact with the substrate.
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申请公布号 |
US2005139482(A1) |
申请公布日期 |
2005.06.30 |
申请号 |
US20040020068 |
申请日期 |
2004.12.23 |
申请人 |
NAGAI MIZUKI;KANDA HIROYUKI;KURASHINA KEIICHI;YAMAMOTO SATORU;SUZUKI HIDENAO;MISHIMA KOJI |
发明人 |
NAGAI MIZUKI;KANDA HIROYUKI;KURASHINA KEIICHI;YAMAMOTO SATORU;SUZUKI HIDENAO;MISHIMA KOJI |
分类号 |
C25D5/10;C25D5/18;C25D7/12;H01L21/288;H01L21/768;(IPC1-7):C25D5/10 |
主分类号 |
C25D5/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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