| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic chuck for reducing the number of particles to be attached to a wafer, after holding the wafer, while maintaining desired Young's modulus. SOLUTION: This ceramic chuck 1 is provided with a surface layer 2, to be brought into contact with a wafer W and a substrate part 6. The surface layer 2 and the substrate 6 are formed through integral sintering, and the porosity of the surface layer 2 is made higher than the porosity of the substrate part 4 and is set so as to be 1% or higher and 10% or lower. Also, ceramic, constituting the substrate 6, contains SiC by 67% or higher. COPYRIGHT: (C)2005,JPO&NCIPI |
