发明名称 Al ALLOY FILM FOR WIRING FILM AND SPUTTERING TARGET MATERIAL FOR FORMING WIRING FILM
摘要 PROBLEM TO BE SOLVED: To provide an Al alloy film for a wiring film, which is applicable to a high-definition large-sized TV and such various flat display devices as to be processed in a low temperature, and has low resistance and high reliability, and to provide a sputtering target for forming the Al alloy film. SOLUTION: The Al alloy film for the wiring film comprises 0.2-1.5 atom% Ge and further 0.2-2.5 atom% Ni as additive elements, while controlling the total of the additive elements to 3.0 atom% or less, and the balance substantially Al. The sputtering target material for forming the wiring film comprises 0.2-1.5 atom% Ge and further 0.2-2.5 atom% Ni as additive elements, while controlling the total of the additive elements to 3.0 atom% or less, and the balance substantially Al. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005171378(A) 申请公布日期 2005.06.30
申请号 JP20040273828 申请日期 2004.09.21
申请人 HITACHI METALS LTD 发明人 MURATA HIDEO
分类号 C23C14/34;C22C21/00;H01L21/28;H01L21/285;H01L21/3205;H01L23/52;(IPC1-7):C23C14/34;H01L21/320 主分类号 C23C14/34
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