MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having a bendable whole-surface IVH structure by imparting a section having flexibility to the multilayer printed wiring board widely used for various electronic equipment. SOLUTION: The multilayer printed wiring board can maintain bending performance by preventing the oozing of resin to the flexible section of a flexible insulating sheet from an adhesive sheet for inter-layer conduction, by making the area of the adhesive sheet for the inter-layer conduction laminated and thermocompression-bonded to the laminated section of the flexible insulating sheet smaller than that of a circuit board. The multilayer printed wiring board has excellent reliabilities on conductions among the layers of the flexible insulating sheet, the adhesive sheet for the inter-layer conduction and the circuit board. COPYRIGHT: (C)2005,JPO&NCIPI