| 摘要 |
PROBLEM TO BE SOLVED: To provide a heatsink in which low thermal expansion nature is secured while the high thermal conductivity of a base material is kept, and the bonding of a heating element such as a semiconductor chip and the heatsink, and the bonding of diamond particles and the base material can sufficiently be performed and a life can be prolonged under a use environment under a temperature cycle in such a structure, and to provide a power module. SOLUTION: In the heatsink 11, the diamond particles 17, 18a and 18b are mixed in the metallic base material 15, and heat from the heating element arranged on one surface 11a-side of the base material 15 is diffused to the other surface side. Metal material layers 32 having coating layers 30 whose materials are the same as the base material 15 are formed on surfaces of the diamond particles 17, 18a and 18b. COPYRIGHT: (C)2005,JPO&NCIPI |
